Two-Component 10:1 Potting Compound For Sealing Circuit Board Led Module Power Potting Protecting Non-Corrosive Low Viscosity Potting Compound
PRODUCT DESCRIPTION
HN-8808, two parts, low viscosity potting compound that cures at room temperature to soft rubber.
Main Application
It is mainly used in circuit boards, LED power supplies, waterproof power supplies, automotive electronic modules, electrical appliances, light sources, lamps, and their accessories for potting protection. Especially for potting with adhesive requirements on aluminum substrates.
Main Feature:
1. This potting silicone rubber has high moisture resistance and a wide temperature range of - 57°C to 250°C.
2. Condensed liquid silicone rubber does not use polar compounds as raw materials, and does not release by-products during cross-linking, and can maintain better electrical properties under harsh conditions.
3. Non-toxic, odorless, non-corrosive, non-swelling.
4. It has adhesive force, has adhesion to metal aluminum, iron, acrylic, and PC plastic, and can improve waterproof sealing performance.
| Before Mixing |
| | A | B |
| Exterior | black liquid | Transparent liquid |
| Base chemical composition | Polysiloxane | Polysiloxane |
| Viscosity (cP) (GB/2794-1995) | 2000-2800 | 20-30 |
| Density (g/cm³) (GB/2794-1995) | 1.42±0.02 | - |
| A+B after mixing |
| Exterior | black liquid |
| Base chemical composition | Polysiloxane (Silicone) |
| Viscosity (cP) (GB/2794-1995) | 2000-2600mpa's |
| Density (g/cm³) (GB/2794-1995) | 1.40±0.02 |
| Operating time (25℃, min) | 40-60 |
| Curing time (25℃, h) | 4-6 |
| Hardness (shore A) (GB/T531-1999) | 30-40 |
| Volume resistivity Ω·cm (GB/T 31838.2-2019) | ≥5.0×10 14 |
| Thermal conductivity (W/M▪K) (GB/T 38712-2020) | 0.5±0.1 |
| Dielectric strength (kv/mm) | ≥14 |
| Dielectric constant | ≤3.5 |
| Elongation at break (%) | ≤100% |
HOW TO USE
According to the dosage, pour it into the mold after mixing according to A: B=10:1.
Remove the surface bubbles and cure at room temperature (the proportion can be adjusted according to actual needs, the larger the proportion of component B, the faster the curing).
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10:1 Silicone Potting Compound Room Temperature Vulcanizing For Sealing Circuit Board Images
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